What type of cooling method fills gaps between the central processing unit (CPU) and other heat-generating components, enabling dissipation of the excess heat? 1 pointHeat sink compound Passive cooling Liquid-based cooling system Active cooling
Question
What type of cooling method fills gaps between the central processing unit (CPU) and other heat-generating components, enabling dissipation of the excess heat? 1 pointHeat sink compound Passive cooling Liquid-based cooling system Active cooling
Solution
The type of cooling method that fills gaps between the central processing unit (CPU) and other heat-generating components, enabling dissipation of the excess heat is the Heat sink compound. This compound, also known as thermal paste or thermal grease, is used to ensure better heat conduction between the CPU and the heat sink, thus helping to keep the CPU cool.
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