X is an IC manufacturing company. They have an order for 9900 IC chips. They started their manufacturing process with 10 silicon ingots each with a radius of 7 cm. Each die should have an area of 1.55 cm2. What is the area of the wafers they are making and how many dies can they make per wafer?
Question
X is an IC manufacturing company. They have an order for 9900 IC chips. They started their manufacturing process with 10 silicon ingots each with a radius of 7 cm. Each die should have an area of 1.55 cm2. What is the area of the wafers they are making and how many dies can they make per wafer?
Solution
First, let's calculate the area of each silicon wafer. The area of a circle (which is the shape of the wafer) is given by the formula πr², where r is the radius of the circle.
Given that the radius of each silicon ingot is 7 cm, the area of each wafer is:
Area = π * (7 cm)² = 153.94 cm²
Next, let's calculate how many dies can be made from each wafer. Given that each die has an area of 1.55 cm², the number of dies per wafer is:
Number of dies = Area of wafer / Area of each die = 153.94 cm² / 1.55 cm² = 99.31
Since we can't have a fraction of a die, we'll round down to the nearest whole number. So, they can make 99 dies per wafer.
Similar Questions
X is an IC manufacturing company. They have an order for 9900 IC chips. They started their manufacturing process with 10 silicon ingots each with a radius of 7 cm. Each die should have an area of 1.55 cm2. What is the area of the wafers they are making and how many dies can they make per wafer? During manufacturing, they discovered that the wafers had 0.035 defects/cm2. Find out the value of yield and comment on it according to the definition of yield.
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